低温银烧结技术的可靠性研究进展*

doi:10.16257/j.cnki.1681-1070.2026.0012

摘要/Abstract

摘要： 随着大功率电子技术的快速发展，芯片的工作温度不断升高。烧结微纳米银因其优异的导电性、导热性和机械强度，成为最具潜力的高温封装互连材料之一。然而，烧结银接头在长期高温环境和频繁开关条件下的可靠性尚未得到全面验证。通过综述烧结银接头在高温老化、热循环、热冲击以及功率循环测试中的可靠性研究，系统梳理了低温银烧结技术的材料与工艺可靠性，并深入分析了导致接头劣化的两大关键机理：热驱动力和热应力的影响。通过分析，旨在总结当前面临的关键技术挑战，并探讨提升烧结银接头可靠性的有效策略。

关键词: 烧结银, 金属化, 老化, 热应力, 可靠性

Abstract: With the rapid development of high-power electronic technology, the operating temperature of chips continues to rise. Sintered micro- and nano-silver, due to their excellent conductivity, thermal conductivity, and mechanical strength, have become one of the most promising high-temperature packaging interconnect materials. However, the reliability of sintered silver joints under long-term high-temperature environments and frequent switching conditions has not been fully validated. By reviewing the reliability research on sintered silver joints in high-temperature aging, thermal cycling, thermal shock and power cycling tests, the material and process reliability of low-temperature silver sintering technology is systematically summarized, and the two key mechanisms leading to joint degradation are deeply analyzed: the thermal driving force effect and thermal stress impact. Through analysis, the current key technical challenges are summarized, and effective strategies to improve the reliability of sintered silver joints are explored.

Key words: sintered silver, metallization, aging, thermal stress, reliability

中图分类号:

王奔，朱志宏，贾少博，汪宝华，丁苏，李万里. 低温银烧结技术的可靠性研究进展^*[J]. 电子与封装, 2026, 26(1): 010206 .

WANG Ben, ZHU Zhihong, JIA Shaobo, WANG baohua, DING Su, LI Wanli. Research Progress on the Reliability of Low-Temperature Silver Sintering Technology[J]. Electronics & Packaging, 2026, 26(1): 010206 .

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中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

低温银烧结技术的可靠性研究进展^*

Research Progress on the Reliability of Low-Temperature Silver Sintering Technology

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