功率电子封装关键材料和结构设计的研究进展*

doi:10.16257/j.cnki.1681-1070.2021.1005

电子与封装 ›› 2021, Vol. 21 ›› Issue (10): 100109 . doi: 10.16257/j.cnki.1681-1070.2021.1005

所属专题：微系统与先进封装技术；封装技术

• “微系统与先进封装技术”专题 • 上一篇下一篇

功率电子封装关键材料和结构设计的研究进展^*

王美玉¹;胡伟波¹;孙晓冬²;汪青³;于洪宇³

1. 南开大学电子信息与光学工程学院，天津　300350；2. 中科芯集成电路有限公司，江苏无锡　214072；3 南方科技大学深港微电子学院，深圳　518055

收稿日期:2021-04-22 出版日期:2021-10-26 发布日期:2021-06-23
作者简介:王美玉（1990—），女，山东菏泽人，博士，副研究员，研究方向为芯片封装结构设计、关键材料、工艺技术及可靠性；

Research Progress on Key Materials and Structure Designof Power Electronics Packaging Materials

WANG Meiyu¹, HU Weibo¹, SUN Xiaodong², WANG Qing³, YU Hongyu³

1. Collegeof Electronic Information and Optical Engineering, Nankai University, Tianjin 300350, China;2. China Key System & Integrated Circuit Co., Ltd., Wuxi 214072, China;3. Department of Electrical and Electronic Engineering, Southern University of Science and Technology, Shenzhen 518055, China

Received:2021-04-22 Online:2021-10-26 Published:2021-06-23

摘要/Abstract

摘要： 传统功率电子封装主要以钎料连接和引线键合等二维平面封装技术为主，无法满足第三代半导体器件在高频、高压、高温下的可靠应用。为了解决这一问题，二维平面封装逐渐向三维集成封装发展。对功率电子封装技术中的关键材料和结构设计的研究进展进行了总结和展望。连接材料从锡基钎料逐渐发展为金基钎料、瞬态液相连接材料、烧结银等高导热、耐高温材料，连接技术从引线键合逐渐发展为双面冷却、器件集成和垂直叠层互连等。通过去除引线提高开关性能，集成多种芯片和器件提高功率密度，双面冷却提高散热效率。三维集成封装具有巨大的市场潜力，将成为未来的主要发展趋势之一。

关键词: 功率电子封装, 封装材料, 封装结构, 三维封装, 烧结银, 硅通孔

Abstract: The traditional power electronics packaging technologies are mainly 2D packaging structures using soldering and wire-bonding interconnections, which could not meet the requirement of high frequency, high power, and high temperature applications for the wide-band-gap semiconductors. Under this circumstances, the 3D power integration packaging technologies are developed. The status and trend of the key packaging materials and structures in the power electronics packaging technologies are summarized and prospected. By using the new interconnection materials such as the Au-based solders, transient liquid phase materials, sintered-silver etc., and the new interconnection technologies such as double-side cooling, component integration, and 3D stack-integration etc., the power module could have a higher electrical performance by eliminating wirebonds, higher power density by integrating multiple devices, and higher thermal performance by using double-side cooling. The 3D packaging will have a great market potential and development trend in the future.

Key words: powerelectronicspackaging, packagingmaterials, packagingstructures, 3Dpackaging, silversintering, throughsiliconvia

中图分类号:

TN305.94

王美玉, 胡伟波, 孙晓冬, 汪青, 于洪宇. 功率电子封装关键材料和结构设计的研究进展^*[J]. 电子与封装, 2021, 21(10): 100109 .

WANG Meiyu, HU Weibo, SUN Xiaodong, WANG Qing, YU Hongyu. Research Progress on Key Materials and Structure Designof Power Electronics Packaging Materials[J]. Electronics & Packaging, 2021, 21(10): 100109 .

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胡伟波（1982—），男，安徽黄山人，博士，教授，研究方向为混合信号电路设计，第三代半导体、雷达小型化。

中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

功率电子封装关键材料和结构设计的研究进展^*

Research Progress on Key Materials and Structure Designof Power Electronics Packaging Materials

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