中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

导航

电子与封装 ›› 2024, Vol. 24 ›› Issue (10): 100207 . doi: 10.16257/j.cnki.1681-1070.2024.0146

• 封装、组装与测试 • 上一篇    下一篇

基于ATE的可编程SiP器件测试

李鹏,白艳放,郑松海,赵娜,刘颖   

  1. 西安现代控制技术研究所,西安 ?710065
  • 收稿日期:2024-04-17 出版日期:2024-10-25 发布日期:2024-10-25
  • 作者简介:李鹏(1996—),男,陕西咸阳人,硕士,助理工程师,研究方向为电子元器件、集成电路测试与失效分析。

Programmable SiP Device Test Based on ATE

LI Peng, BAI Yanfang, ZHENG Songhai, ZHAO Na, LIU Ying   

  1. Xi’an ModernControl Technology Research Institute, Xi’an 710065, China
  • Received:2024-04-17 Online:2024-10-25 Published:2024-10-25

摘要: 分析了SiP器件内部数字芯片FPGA和模拟芯片ADC/DAC的主要电气参数及性能参数,明确了SiP器件的测试内容和方法。使用Altium Designer软件设计SiP6117M信号处理器专用测试板,结合测试需求、测试流程以及芯片具体参数提出设计目标,完成原理图设计、PCB设计、制板和调试工作。基于UltraFlex测试机台和设计完成的测试板搭建SiP6117M模块的测试平台,运用Verilog语言编写FPGA配置程序及测试程序,并通过JTAG接口对FPGA进行配置。开发UltraFlex测试程序对测试过程进行控制,实现了对SiP器件主要功能和性能参数的测试。

关键词: SiP, 测试板设计, 测试平台, 测试数据

Abstract: The main electrical parameters and performance parameters of the internal digital chip FPGA and analog chip ADC/DAC of SiP devices are analyzed, and the testing contents and methods of SiP devices are clarified. Altium Designer software is used to design the SiP6117M signal processor dedicated test board. According to the test requirements, test flow and specific parameters of the chip, the design objectives are put forward, and the schematic design, PCB design, board making and debugging work are completed. A testing platform for the SiP6117M module is built based on the Ultra Flex testing machine and the designed test board. The FPGA configuration program and testing program are written using Verilog language, and the FPGA is configured through the JTAG interface. An Ultra Flex testing program is developed to control the testing process, achieving the testing of the main functions and performance parameters of SiP devices.

Key words: SiP, test board design, test platform, test data

中图分类号: