中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

导航

电子与封装

• 电路与系统 •    下一篇

JESD204B型多通道高速SiP处理芯片的设计与分析

盛沨,田元波,谢达   

  1. 无锡中微亿芯有限公司,江苏 无锡  214072
  • 收稿日期:2025-02-25 修回日期:2025-03-31 出版日期:2025-04-11 发布日期:2025-04-11
  • 通讯作者: 盛沨
  • 基金资助:
    国家重点研发计划(SQ2024YFB4500147)

Design and Analysis of JESD204B-Type Multi-Channel High-Speed SiP Processing Chips

SHENG Feng, TIAN Yuanbo, XIE Da   

  1. Wuxi Esiontech Co., Ltd., Wuxi 214072, China
  • Received:2025-02-25 Revised:2025-03-31 Online:2025-04-11 Published:2025-04-11

摘要: 研究高速系统级封装(SiP)处理芯片对现代高速数据处理领域的发展具有重要的实际应用价值。针对目前高速处理系统普遍存在通道数少、集成度低、占用面积大、易受干扰等问题,论文中提出一种以现场可编程门阵列(FPGA)为核心、集八路采集和八路输出为一体、支持“电子器件工程联合委员会标准204B”(JESD204B)标准化串行接口传输的高速SiP处理芯片。其内部的模数转换器(ADC)与数模转换器(DAC)均为高速采集芯片,支持JESD204B接口协议,串行器(SERDES)速率最高可达10 Gbit/s,能够实现数据的快速传输以及信号的高效处理。本文深入分析了该SiP处理芯片的架构组成以及性能参数,实际测得芯片的整体面积仅为20.25 cm2、输入采样及输出采样最高分别可达1 GFrame/s和2.4 GFrame/s、通道隔离度在75 dB左右。同时,提出一种时钟芯片外挂的架构策略,有效地提高了芯片的耐高温性能,进一步拓展了该类高速SiP芯片的应用场景及适用环境。

关键词: JESD204B, 多通道, 高速, SiP, 性能

Abstract: Research on high-speed system level package (SiP) processing chips has important practical application value for the development of modern high-speed data processing field. Aiming at the problems of low channel number, low integration, large occupation area, and easy interference in current high-speed processing systems, this paper proposes a high-speed SiP processing chip that takes field programmable gate array (FPGA) as the core, integrates eight channels of acquisition and eight channels of output, and supports the standardized serial interface transmission of "Joint Commission on Electronic Devices Engineering Standard 204B" (JESD204B). The internal analog-to-digital converter (ADC) and digital to analog converter (DAC) are high-speed acquisition chips, which support JESD204B interface protocol, and the serial device (SERDES) speed can reach up to 10 Gbit/s, enabling fast data transmission and efficient signal processing. This paper deeply analyzes the architecture and performance parameters of the SiP processing chip. The actual measured overall area of the chip is only 20.25 cm2, the maximum input sampling and output sampling can reach 1 GFrame/s and 2.4 GFrame/s respectively, and the channel isolation is about 75 dB. At the same time, a clock chip plug-in architecture strategy is proposed, which effectively improves the high temperature resistance of the chip, and further expands the application scenarios and application environments of this kind of high-speed SiP chips.

Key words: JESD204B, multi-channel, high-speed, SiP, performance