关键词: 异构集成, 多学科协同设计, 多物理场模拟, 机械驱动

Abstract: Heterogeneous integration technology represents a key pathway for enhancing integrated circuit performance in the post-Moore's Law era. However, its high density and multi-material characteristics pose severe challenges in coupled electrical-thermal-mechanical multi-physics.  Centering on multidisciplinary collaboration and mechanical cross-boundary drivers, this paper systematically reviews co-design methodologies, multi-scale modeling and simulation techniques, and engineering application advancements in heterogeneous integration. The research reveals that mechanical factors such as residual stresses and interface warping induced by Coefficient of Thermal Expansion mismatch are deeply coupled with electromigration and Joule heating dynamics. These factors have become core variables that determine interconnect stability and system energy efficiency boundaries. To effectively address these coupling bottlenecks, this paper summarizes a cross-hierarchical and bidirectional closed-loop co-design paradigm. This framework uses system power consumption and bandwidth as primary targets to drive the forward co-selection of packaging, interconnects, and materials. Meanwhile, multi-physics simulation results provide reverse constraints for architectural layouts and process windows, while multiscale modeling enables the bidirectional transfer of critical parameters and rapid convergence. Looking forward, the article suggests the further integration of Artificial Intelligence (AI)-driven next-generation Electronic Design Automation (EDA) toolchains. This will promote the transition from design synergy to standardized ecosystem collaboration, providing the necessary physical support for the high-reliability evolution of Chiplets and Three-Dimensional Integrated Circuits (3D ICs).

Key words: heterogeneous integration, multidisciplinary co-design, multiphysics simulation, mechanical-driven