关键词: 半导体封测, 2.5D封装, 3D封装, 专利技术, 异构集成

Abstract: With the vigorous development of industries such as artificial intelligence and high-performance computing, advanced packaging technology has become a crucial path to continue Moore's Law. This article focuses on 2.5D and 3D packaging technologies, systematically reviews the patent technology systems centered around packaging structures, interposers, and substrates, analyzes the innovation points, technical advantages, and market applications of typical patents, reveals the patent layout strategies and industrial competition landscape in the semiconductor packaging and testing field, and provides references for relevant enterprises in technology research and development and patent layout.

Key words: Semiconductor Assembly and Test, 2.5D Packaging, 3D Packaging, Patent Technology, Heterogeneous Integration