微纳铜材料的制备及其在封装互连中的应用*

doi:10.16257/j.cnki.1681-1070.2025.0008

摘要/Abstract

摘要： 半导体器件的快速发展对封装互连材料提出了更高的要求。微纳铜材料具有良好的导电、导热和机械性能。与常用的微纳银相比，微纳铜具有更强的抗电迁移能力和更低的成本，在封装互连领域被广泛应用。微纳铜材料的制备方法可分为化学法、物理法、生物法3类，其中化学液相还原法以低成本、高可控、工艺简单等优势占据重要地位。不同的封装互连工艺步骤需要不同形貌的微纳铜颗粒。微纳铜材料在封装互连中主要应用于芯片固晶、Cu-Cu键合、细节距互连等工艺，探讨了微纳铜材料在以上工艺中的应用，并对微纳铜材料在封装互连中的应用进行展望。

关键词: 微纳铜, 化学液相还原法, 封装互连

Abstract: The rapid development of semiconductor devices has put forward higher requirements for package interconnection materials. Micro-nano copper material has good electrical, thermal and mechanical properties. Compared with the commonly used micro-nano silver, micro-nano copper has stronger resistance to electromigration and lower cost, and micro-nano copper is widely used in the field of package interconnection. The preparation methods of micro-nano copper materials can be divided into three categories: chemical method, physical method, and biological method, among which the chemical liquid-phase reduction method occupies an important position with the advantages of low cost, high controllability, and simple process. Different package interconnection process steps require micro-nano copper particles with different morphologies. Micro-nano copper materials are mainly used in processes such as chip solidification, Cu-Cu bonding, and fine pitch interconnection in package interconnection, the applications of micro-nano copper materials in the above processes are discussed, and the applications of micro-nano copper materials in package interconnections are prospected.

Key words: micro-nano copper, chemical liquid-phase reduction method, package interconnection

中图分类号:

TN305.94

彭琳峰，杨凯，余胜涛，刘涛，谢伟良，杨世洪，张昱，崔成强. 微纳铜材料的制备及其在封装互连中的应用^*[J]. 电子与封装, 2025, 25(1): 010202 .

PENG Linfeng, YANG Kai, YU Shengtao, LIU Tao, XIE Weiliang, YANG Shihong, ZHANG Yu, CUI Chengqiang. Preparation of Micro-Nano Copper Material and Its Applications in Package Interconnection[J]. Electronics & Packaging, 2025, 25(1): 010202 .

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中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

微纳铜材料的制备及其在封装互连中的应用^*

Preparation of Micro-Nano Copper Material and Its Applications in Package Interconnection

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