关键词: 高密度, 陶瓷封装, 结构分析

Abstract: The past decades have witnessed long term evolution of high-density ceramic packaging technology in the aspects of size,materials and construction.Traditional standards fail to tackle all failures that may occur during the packaging,test and operation of ICs.Reliability test and inspection measures cannot ensure satisfactory reliability.The paper focuses on construction weak points of ICs,such as package and interconnects,and deconstructs high-density CQFP-packaged IC for construction analysis.

Key words: high-density, ceramic package, CA