关键词: 2.5D器件, 硅通孔, ANSYS仿真, 结构设计

Abstract: This paper studied the structure design and simulation analysis of the TSV (Through Silicon Via) in 2.5D electronic devices by ANSYS software and ensured the more reasonable TSV structure in the aerospace application environment according to the simulation results. Firstly, we compared with the thermal mechanical behavior of several TSV Structure in the temperature cycles; then chose variable material to form four different TSV structures, studied the stress concentration behavior and long-term reliability in the those TSV structures. In the end we found the more reliable TSV structure to guarantee the 2.5D electronic devices quality to comfort with aerospace application environment.

Key words: 2.5Ddevices, throughsiliconvia, ANSYS, structuredesign