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• 材料、器件与工艺 •    下一篇

氮化镓(多晶硅)异质结势垒肖特基二极管的载流子传输机制研究

薛文文1,丁继洪2,张彦文1,黄伟1,张卫1   

  1. 1. 复旦大学微电子学院,上海  200433;2. 华东光电集成器件研究所,安徽 蚌埠  233030
  • 收稿日期:2024-12-05 修回日期:2025-03-04 出版日期:2025-03-12 发布日期:2025-03-12
  • 通讯作者: 黄伟

Carrier Transport Mechanism of GaN (PolySi) Heterojunction Barrier Schottky Diodes

XUE Wenwen1, DING Jihong2, ZHANG Yanwen1, HUANG Wei1, ZHANG Wei1   

  1. 1. School of Microelectronics, Fudan University, Shanghai 200433, China; 2. East China Institute of Photo-Electron IC, Bengbu 233000, China

  • Received:2024-12-05 Revised:2025-03-04 Online:2025-03-12 Published:2025-03-12

摘要: 开展了基于GaN(p-PolySi)结构的新型异质结势垒肖特基(HJBS)二极管及其输运机制研究。研究结果表明,器件正反向偏压的工作机理均与GaN/polySi异质结处形成的缺陷相关。在-80~+80 ℃的偏置温度范围内,不同偏压和温度范围下该器件具有不同的电流输运机制。1)在正向偏压下,器件处于Ⅰ区域(Vf < 0.5 V)且温度高于-20 ℃时,多隧道捕获-发射模式(MTCE)是主要的导通机制;2)当器件处于Ⅰ区域(Vf < 0.5 V)且温度低于-20 ℃时,热离子发射是主要的导通机制,这与界面处势垒高度不均匀有关;3)器件处于Ⅱ区域(0.5 V < Vf < 0.9 V)时,F-N隧穿是主要的导通机制。上述器件正向特性的输运机制都与氮化镓中碳原子形成的类施主缺陷相关。另一方面,在反向偏压下,简并器件的漏电流机制可以概括为:在较低的反向电压下(Vr< 50 V),势垒还原效应占主导地位;在较高的反向电压(Vr> 50 V)下,空间电荷限制电流(SCLC)机制占主导地位。

关键词: 异质结势垒肖特基二极管(HJBS), 氮化镓, 硅, 陷阱辅助的多隧穿捕获与发射

Abstract: This paper presents the first study on the transport mechanism of a novel heterojunction barrier Schottky diode (HJBS) based on a GaN (p-PolySi) structure. The research results indicate that the operating mechanisms under both forward and reverse bias are associated with defects formed at the GaN/polySi heterojunction. Within the bias temperature range of -80~+80℃, the device exhibits different current transport mechanisms depending on the bias and temperature conditions. 1) Under forward bias, when the device is in the Region I (Vf < 0.5 V) and the temperature is above -20℃, the main conduction mechanism is the multi-tunnel capture-emission (MTCE) mode; 2) when the device is in Region I (Vf < 0.5 V) and the temperature is below -20℃, thermionic emission becomes the primary conduction mechanism, which is related to the uneven barrier height at the interface; 3) when the device is in Region Ⅱ (0.5 V < Vf < 0.9 V), Fowler-Nordheim (F-N) tunneling serves as the main conduction mechanism. All the transport mechanisms of the device's forward characteristics are associated with donor-like defects formed by carbon atoms in gallium nitride. On the other hand, under reverse bias, the leakage current mechanism of the degenerate device can be summarized as follows: at lower reverse voltages (Vr < 50 V), the barrier reduction effect dominates; at higher reverse voltages (Vr > 50 V), the space charge limited current (SCLC) mechanism prevails.

Key words: GaN, heterojunction barrier schottky diodes (HJBS), trap-assisted multi tunneling capture-emission