玻璃通孔技术的射频集成应用研究进展*

doi:10.16257/j.cnki.1681-1070.2025.0128

摘要/Abstract

摘要： 随着射频系统向高频化、集成化方向发展，玻璃通孔（TGV）技术凭借玻璃基板的低介电损耗和高热导率，成为突破传统基板限制的核心方案。系统综述了TGV技术的制造工艺、射频器件集成创新及其在5G/6G通信与毫米波系统中的应用进展。在射频器件领域，TGV通过三维互连显著提升集总式电感、电容等无源器件的性能，并支撑滤波器设计实现低插入损耗和小型化。天线应用中，TGV多层堆叠技术推动封装天线向毫米波频段拓展，同时通过极薄转接板与嵌入式扇出技术提升互连密度、实现射频异质集成。未来发展趋势包括高深宽比通孔工艺革新、高频工艺一致性提升及多物理场协同设计，以突破毫米波频段性能瓶颈，加速TGV在5G/6G通信、太赫兹系统及智能终端中的规模化应用，为射频集成与异质封装提供高性能、低成本解决方案。

关键词: 玻璃通孔, 集成无源器件, 滤波器, 封装天线, 玻璃基板, 玻璃转接板, 异质集成

Abstract: With the development of radio frequency (RF) systems towards high frequency and integration, through glass via (TGV) technology has become a core solution to break through the limitations of traditional substrates due to the low dielectric loss and high thermal conductivity of glass substrates. The manufacturing process, RF device integration innovation, and application progress of TGV technology in 5G/6G communication and millimeter wave systems are systematically reviewed. In the field of RF devices, TGV significantly improves the performance of passive devices such as lumped inductors and capacitors through three-dimensional interconnection, and supports filter design to achieve low insertion loss and miniaturization. In antenna applications, TGV multi-layer stacking technology promotes the expansion of packaged antennas to the millimeter wave frequency band, while improving interconnection density and achieving RF heterogeneous integration through ultra-thin adapter boards and embedded fan out technology. The future development trends include innovations in high aspect ratio through-hole technology, improvement in high-frequency process consistency, and multi physics field collaborative design to break through the performance bottleneck of millimeter wave frequency band, accelerate the large-scale application of TGV in 5G/6G communications, terahertz systems, and intelligent terminals, and provide high-performance and low-cost solutions for RF integration and heterogeneous packaging.

Key words: through glass via, integrated passive device, filter, packaged antenna, glass substrate, glass adapter plate, heterogeneous integration

中图分类号:

TN305.94

喻甜，陈新，林景裕，钟毅，梁峻阁，顾晓峰，于大全. 玻璃通孔技术的射频集成应用研究进展^*[J]. 电子与封装, 2025, 25(7): 070101 .

YU Tian, CHEN Xin, LIN Jingyu,ZHONG Yi, LIANG Junge, GU Xiaofeng, YU Daquan. Advances in Radio Frequency Integration Applications of Through Glass Via Technology[J]. Electronics & Packaging, 2025, 25(7): 070101 .

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中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

玻璃通孔技术的射频集成应用研究进展^*

Advances in Radio Frequency Integration Applications of Through Glass Via Technology

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