玻璃基键合技术研究进展*

doi:10.16257/j.cnki.1681-1070.2025.0139

摘要/Abstract

摘要： 随着三维集成技术的不断发展，玻璃基封装凭借其独特的优势开始被广泛研究。键合技术作为玻璃基封装的关键及难点，是构建“芯片高楼”的直接核心，需同时满足物理连接强度、电学可靠性及异质材料热匹配等严苛要求。键合技术从是否需要整体加热上可分为以热压扩散键合、阳极键合为代表的热键合，以及以超高真空表面活化键合、激光键合为代表的室温键合。低真空等离子体活化、真空紫外线光活化、湿化学活化等表面处理技术对降低键合温度、提高键合成功率非常有效。通过综述玻璃基键合技术的原理和特点，阐述了不同键合技术在不同应用场景下的优劣势，为玻璃基键合技术的持续创新和发展提供参考和思路。

关键词: 玻璃基封装, 三维集成, 键合技术, 表面处理

Abstract: With the continuous development of 3D integration technology, glass-based packaging has begun to be widely researched due to its unique advantages. Bonding technology, as the key and a major challenge of glass-based packaging, is the direct core of constructing “chip skyscrapers”. It must simultaneously meet stringent requirements for physical connection strength, electrical reliability, and thermal compatibility of heterogeneous materials. Based on whether global heating is required, bonding technologies can be categorized into two groups: thermal bonding, represented by thermocompression diffusion bonding and anodic bonding, and room-temperature bonding, represented by ultrahigh-vacuum surface-activated bonding and laser bonding. Surface treatment technologies, including low-vacuum plasma activation, vacuum ultraviolet irradiation activation, and wet-chemical activation, are highly effective in reducing bonding temperature and enhancing bonding success rate. Through a review of the technical principles and characteristics of glass-based bonding technologies, their advantages and disadvantages in diverse application scenarios are evaluated, providing references and ideas for the continuous innovation and development of glass-based bonding technology.

Key words: glass-based packaging, 3D integration, bonding technology, surface treatment

中图分类号:

TN305.94

傅觉锋，陈宏伟，刘金旭，张继华. 玻璃基键合技术研究进展^*[J]. 电子与封装, 2025, 25(7): 070102 .

FU Juefeng, CHEN Hongwei, LIU Jinxu, ZHANG Jihua. Research Progress of Glass-Based Bonding Technology[J]. Electronics & Packaging, 2025, 25(7): 070102 .

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中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

玻璃基键合技术研究进展^*

Research Progress of Glass-Based Bonding Technology

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