关键词: 透射扫描, 超声扫描, 透射模式, 反射模式, 芯片粘接界面分层, 可靠性

Abstract: In ultrasonic scanning microscopy（SAM）testing, defect detection is typically performed using reflection mode, while transmission mode is used only as a secondary criterion for detecting delamination at chip bonding interfaces. However, reflection mode is susceptible to interference from various factors, such as interface characteristics and material properties, which may lead to misjudgments under specific conditions. Through analysis and research on the standalone application of transmission scanning, as well as its synergistic use with reflection mode in specific testing scenarios, it was found that the practical value of transmission scanning far exceeds its original role as a  criterion for determining the layering of chip bonding layers. This provides industry peers with an alternative approach to analyzing testing phenomena.

Key words: transmission scanning, ultrasonic scanning, transmission mode, reflection mode, chip bonding interface delamination, reliability