基于基板折叠的多面立体封装技术研究进展*

doi:10.16257/j.cnki.1681-1070.2025.0169

摘要/Abstract

摘要： 基于基板折叠的多面立体封装由互不平行的基板构成，是一种特殊的3D立体封装，具有较高的功能密度和散热能力，在传感器、医疗设备等多种应用场景下有重要的研究价值。介绍了基于基板折叠的多面立体封装的概念与国内外研究现状，系统总结了该类封装的典型结构、基板材料、组装工艺、散热及代表性应用。重点分析了基于基板折叠的多面立体封装与其他类型3D封装之间的差异，探讨了该封装技术的独特优势与亮点。最后，对该技术在有源相控阵T/R组件和光电共封领域的发展前景进行了展望。

关键词: 多面立体封装, 传感器, 3D封装, T/R组件, 光电共封装

Abstract: Polyhedral 3D packaging based on substrate folding consists of non-parallel substrates, representing a specialized form of 3D packaging. It offers high functional density and thermal dissipation capabilities, making it a subject of significant research value across diverse applications such as sensors and medical devices. The concept of polyhedral 3D packaging based on substrate folding is introduced and the current states of research both domestically and internationally are reviewed. The typical structures, substrate materials, assembly processes, thermal management, and representative applications of this type of packaging are systematically summarized. The distinctions between substrate folding-based polyhedral packaging technology and other 3D packaging types are analyzed, highlighting its unique advantages and salient features. Finally, development prospects in the fields of active phased array T/R modules and co-packaged optics are outlined.

Key words: polyhedral 3D packaging, sensor, 3D packaging, T/R module, co-packaged optics

中图分类号:

TN305.94

毕博，潘碑，张晋，成海峰，葛振霆，刘子玉. 基于基板折叠的多面立体封装技术研究进展^*[J]. 电子与封装, 2025, 25(12): 120208 .

BI Bo, PAN Bei, ZHANG Jin, CHENG Haifeng, GE Zhenting, LIU Ziyu. Research Progress on Substrate Folding-Based Polyhedral 3D Packaging Technology[J]. Electronics & Packaging, 2025, 25(12): 120208 .

参考文献

[1] LOUBET N, HOOK T, MONTANINI P, et al. Stacked nanosheet gate-all-around transistor to enable scaling beyond FinFET[C]// 2017 Symposium on VLSI Technology, Kyoto, Japan, 2017: T230-T231.
[2] BAE G, BAE D I, KANG M, et al. 3nm GAA technology featuring multi-bridge-channel FET for low power and high performance applications[C]// 2018 IEEE International Electron Devices Meeting (IEDM), San Francisco, CA, USA, 2018: 28.7.1-28.7.4.
[3] MOROZ V, LIN X W, ASENOV P, et al. DTCO launches Moore’s law over the feature scaling wall[C]// 2020 IEEE International Electron Devices Meeting (IEDM), San Francisco, CA, USA, 2020: 41.1.1-41.1.4.
[4] 曹立强, 张霞, 于燮康. 新型埋入式板级封装技术[J]. 中国科学: 信息科学, 2012, 42(12): 1588-1598.
[5] FRUEHAUF P, MUNDING A, PRESSEL K, et al. Chip-package-board reliability of System-in-Package using laminate chip embedding technology based on Cu leadframe[C]// 2018 7th Electronic System-Integration Technology Conference (ESTC), Dresden, Germany, 2018: 1-7.
[6] JIA X F, LI X C, ERDOGAN S, et al. Antenna with embedded die in glass interposer for 6G wireless applications[J]. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2023, 13(2): 219-229.
[7] MORI K, OASA K, IMI H, et al. Model-based development to improve electrical and thermal performances for robust Si power MOSFETs using embedded die packaging technology[C]// 2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC), Berlin, Germany, 2024: 1-8.
[8] CHOUDHURY A, KUMBHAT N, KHAN S A, et al. High throughput and fine pitch Cu-Cu interconnection technology for multichip chip-last embedding[C]// 2011 IEEE 61st Electronic Components and Technology Conference (ECTC), Lake Buena Vista, FL, USA, 2011: 2021-2027.
[9] CHAO S H, HUNG C P, LAI Y S, et al. A study of chip-last embedded FCCSP[C]// 2015 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC), Kyoto, Japan, 2015: 78-82.
[10] SHIH M, HUANG C Y, CHEN T H, et al. Electrical, thermal, and mechanical characterization of eWLB, fully molded fan-out package, and fan-out chip last package[J]. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2019, 9(9): 1765-1775.
[11] HOLLSTEIN K, WEIDE-ZAAGE K. Advances in packaging for emerging technologies[C]// 2020 Pan Pacific Microelectronics Symposium (Pan Pacific), HI, USA, 2020: 1-11.
[12] QIN I, YAUW O, SCHULZE G, et al. Advances in wire bonding technology for 3D die stacking and fan out wafer level package[C]// 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), Orlando, FL, USA, 2017: 1309-1315.
[13] HE H Y, LU J J Q, GU X X. Analysis of TSV geometric parameter impact on switching noise in 3D power distribution network[C]// 25th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2014), Saratoga Springs, NY, USA, 2014: 67-72.
[14] KAWANO M, WANG X Y, REN Q, et al. Wafer stacked wide I/O DRAM with one-step TSV technology[C]// 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), San Diego, CA, USA, 2022: 143-148.
[15] 苏梅英, 陆原, 万里兮, 等. 基于三维多芯片柔性封装的热应力分析[J]. 现代电子技术, 2015, 38(3): 141-143.
[16] 赵心然, 袁渊, 王刚, 等. 混合键合技术在三维堆叠封装中的研究进展[J]. 半导体技术, 2023, 48(3): 190-198.
[17] PARK J, LEE B, LEE H, et al. Wafer to wafer hybrid bonding for DRAM applications[C]// 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), San Diego, CA, USA, 2022: 126-129.
[18] 李军. 三维封装电磁干扰的分析与防护设计[D]. 杭州: 浙江大学, 2017.
[19] BUCKLEY J, O’FLYNN B, BARTON J, et al. A highly miniaturized wireless inertial sensor using a novel 3D flexible circuit[J]. Microelectronics International, 2009, 26(3): 9-21.
[20] LI S. Microsystem based on SiP technology[M]. Singapore: Springer Nature Singapore, 2022.
[21] BARTON J, MAJEED B, DWANE K, et al. Development and characterisation of ultra thin autonomous modules for ambient system applications using 3D packaging techniques[C]// 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546), Las Vegas, NV, USA: IEEE, 2004:635-641.
[22] BARTON J, GONZALEZ A, BUCKLEY J, et al. Design, fabrication and testing of miniaturised wireless inertial measurement units (IMU)[C]// 2007 Proceedings 57th Electronic Components and Technology Conference, Sparks, NV, USA, 2007: 1143-1148.
[23] MARTINEZ-CATALA R V, BARRETT J. A modular wireless sensor platform with fully integrated battery[J]. IEEE Transactions on Components and Packaging Technologies, 2009, 32(3): 617-626.
[24] MOORE L, BARRETT J. Miniature embedded prognostic probe[C]// 2011 IEEE Conference on Prognostics and Health Management, Denver, CO, USA, 2011: 1-8.
[25] MOORE L, BARRETT J. Board-folding method for fabrication of 3-D system in package devices[J]. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2012, 2(7): 1209-1216.
[26] ROJAS D, BARRETT J. A novel 3-D embedded module for displacement measurement in metal structures[J]. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2017, 7(11): 1765-1773.
[27] GU Y K, XIE X, WANG Z Q, et al. A new globularity capsule endoscopy system with multi-camera[C]// 2009 IEEE Biomedical Circuits and Systems Conference, Beijing, China, 2009: 289-292.
[28] GU Y K, XIE X, LI G L, et al. A new system design of the multi-view Micro-Ball endoscopy system[C]// 2010 Annual International Conference of the IEEE Engineering in Medicine and Biology, Buenos Aires, Argentina, 2010: 6409-6412.
[29] ZHU X X, CAI J, CHEN Y, et al. The miniaturization of a micro-ball endoscope by SiP approach[C]// 2014 IEEE 64th Electronic Components and Technology Conference (ECTC), Orlando, FL, USA, 2014: 1378-1383.
[30] HOLDA M E, LYNCH C, TENTZERIS M M. Additively manufactured magic cube platforms for fully integrated wireless sensing nodes for Internet of Things applications[J]. Scientific Reports, 2023, 13: 21736.
[31] BERéNYI R. Prototyping of a reliable 3D flexible IC cube package by laser micromachining[J]. Microelectronics Reliability, 2009, 49(7): 800-805.
[32] 李扬. 一种盒式三维系统级封装: CN109904082A[P]. 2018-03-30.
[33] 李扬. 一种气密性三维系统级封装: CN212303661U[P]. 2018-05-25.
[34] 金国庆, 曹立强. 一种立体封装结构及其制备方法: CN115895461A[P]. 2020-09-04.
[35] LI D M, FENG X C, LIAN B H, et al. A kind of 3D hybrid assembly structure and technology[C]// 2013 14th International Conference on Electronic Packaging Technology, Dalian, China, 2013: 79-83.
[36] SCHUH P, RIEGER R, FLECKENSTEIN A, et al. T/R-module technologies today and possible evolutions[C]// 2009 International Radar Conference, Bordeaux, France, 2009: 1-5.
[37] 王坚灿. Ku波段瓦片式TR组件研究与设计[D]. 西安: 西安电子科技大学, 2018.
[38] TIAN W C, HOU H H, DANG H J, et al. Progress in research on co-packaged optics[J]. Micromachines, 2024, 15(10): 1211.

中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

基于基板折叠的多面立体封装技术研究进展^*

Research Progress on Substrate Folding-Based Polyhedral 3D Packaging Technology

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