中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

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电子与封装 ›› 2025, Vol. 25 ›› Issue (7): 070103 . doi: 10.16257/j.cnki.1681-1070.2025.0122

• “玻璃通孔技术进展和应用”专题 • 上一篇    下一篇

应力缓冲层对玻璃基板填孔结构内应力及可靠性的调控规律研究*

王展博;张泽玺;杨斌;郭旭;杨冠南;张昱;黄光汉;崔成强   

  1. 广东工业大学省部共建精密电子制造技术与装备国家重点实验室,广州  510006
  • 收稿日期:2025-02-28 出版日期:2025-08-01 发布日期:2025-08-01
  • 作者简介:王展博(1999—),男,河南洛阳人,硕士研究生,主要研究方向为微电子封装工艺与可靠性。

Regulation Study of Stress Buffer Layer on the Internal Stress and Reliability of Glass Substrate Hole-Filling Structures

WANG Zhanbo, ZHANG Zexi, YANG Bin, GUO Xu, YANG Guannan, ZHANG Yu, HUANG Guanghan, CUI Chengqiang   

  1. State Key Laboratory of Precision ElectronicManufacturing Technology and Equipment,
  • Received:2025-02-28 Online:2025-08-01 Published:2025-08-01

摘要: 玻璃具有优良的高频电学特性、机械稳定性以及低成本等优势,是下一代高密度封装基板的理想材料。然而玻璃与铜的热膨胀系数存在较大差异,在温度变化过程中容易产生较大热应力,特别是在玻璃通孔(TGV)等关键结构附近,影响了玻璃基板的性能与可靠性。针对玻璃基板填孔结构的可靠性问题,通过有限元模拟与实验手段,研究了在玻璃与铜的界面引入一层有机聚合物作为应力缓冲层的方法,以调控界面内应力并提高其可靠性。分析了有机聚合物厚度对玻璃填孔结构热应力的影响规律。仿真结果表明,插入厚度为1 µm的缓冲层可将玻璃基板的最大主应力降低约40%。通过实验进一步验证了具有应力缓冲层的玻璃基板的热应力可靠性得到了明显提升。

关键词: 玻璃基板, 玻璃通孔, 可靠性, 有限元模拟

Abstract: Glass has excellent advantages of high-frequency electrical properties, mechanical stability and low cost, making it an ideal material for the next generation of high-density packaging substrates. However, there is a significant difference in the coefficients of thermal expansion between glass and copper, considerable thermal stress is prone to occur during temperature changes, especially near key structures such as through glass vias (TGVs), which affects the performance and reliability of the glass substrate. Aiming at the reliability issue of the glass substrate hole-filling structure, the finite element simulation and experimental methods are used to study the introduction of an organic polymer layer at the interface between glass and copper as a stress buffer layer to regulate the internal stress at the interface and improve its reliability. The influence law of the organic polymer thickness on the thermal stress in glass filling structure is analyzed. The simulation results show that inserting a buffer layer with a thickness of 1 µm can reduce the maximum principal stress of the glass substrate by approximately 40%. The experiments further verify that the thermal stress reliability of the glass substrate with a stress buffer layer has been significantly improved.

Key words: glass substrate, through glass via, reliability, finite element simulation

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