关键词: 键合, 超低弧, 叠层

Abstract: Laminated packaging technology is a widely used 3D packaging technology, which can meet the requirements of high performance, light weight, low power consumption and small size of electronic products. Due to the special structure of this technology, the arc height of 100~200μm formed by traditional wire bonding technology is difficult to meet the requirements. Ultra-low line arc technology is mainly to reduce the height of the bonded line arc, reduce the line arc height to 50μm or even lower, so as to improve the density of the package, to meet the development needs of thin. In the application scenario of the in-line arc height of 50μm or less, the application of such technology is very important to improve the performance and density of electronic devices. By optimizing the arc parameters and verification test, the bonding quality and stability of the ultra-low arc are improved while ensuring the mechanical properties of the ultra-low arc, and the difficulties in the verification process are analyzed and improved, and the process research of ultra-low arc packaging is finally realized.

Key words: Lamination, Bonding, Ultra-low arc