中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

导航

电子与封装 ›› 2025, Vol. 25 ›› Issue (7): 070106 . doi: 10.16257/j.cnki.1681-1070.2025.0157

• “玻璃通孔技术进展和应用”专题 • 上一篇    下一篇

玻璃通孔技术及其可靠性研究现状*

马丙戌1;王浩中1,2;钟祥祥1,2;向峻杉3;刘沛江1;周斌1;杨晓锋1   

  1. 1. 中国电子产品可靠性与环境试验研究所,广州  511330;2. 哈尔滨工业大学材料科学与工程学院, 广东 深圳  518055;3. 中国电子科技集团公司第二十四研究所,重庆  400030
  • 收稿日期:2025-03-31 出版日期:2025-08-01 发布日期:2025-08-01
  • 作者简介:马丙戌(1994—),男,河南洛阳人,博士,工程师,主要研究方向为先进封装材料与微系统可靠性。

Research Status of Through Glass Via Technology and Its Reliability

MA Bingxu1,WANG Haozhong1,2, ZHONG Xiangxiang1,2, XIANG Junshan3, LIU Peijiang1, ZHOU Bin1, YANG Xiaofeng1   

  1. 1. China Electronic Product Reliability and Environmental Testing ResearchInstitute, Guangzhou 511330, China; 2. School of Materials Science and Engineering,Harbin Institute of Technology,Shenzhen 518055, China; 3. China Electronics Technology GroupCorporation No.24 Research Institute,Chongqing 400030, China
  • Received:2025-03-31 Online:2025-08-01 Published:2025-08-01

摘要: 玻璃通孔(TGV)技术作为三维集成和先进封装的关键技术,以其优异的高频性能、低介电损耗和良好的热机械稳定性,在射频器件、高密度异构集成器件、光电共封装器件等领域展现出广阔的应用前景。然而,TGV技术的可靠性问题仍是制约其大规模产业化的核心挑战之一。系统综述了TGV技术的发展历程、应用研究现状、玻璃转接板制备工艺、可靠性研究进展。着重讨论了TGV关键互连结构由加工、设计、热应力等引起的可靠性问题,在总结常见互连失效机制之后,指出了目前TGV的可靠性研究在多场耦合失效研究、多性能参数协同评估、失效分析手段开发方面的不足。最后针对未来基于TGV技术开发新一代高性能器件的需求,分析了进一步开展可靠性研究工作需要关注的重点,为后续围绕玻璃转接板和TGV技术进行系统性的可靠性研究提供借鉴和参考。

关键词: 玻璃通孔技术, 先进封装, 可靠性研究, 热机械疲劳失效, 电迁移

Abstract: Through glass via (TGV) technology, as a key technology for three-dimensional integration and advanced packaging, demonstrates broad application prospects in radio frequency devices, high-density heterogeneous integration devices, and optoelectronic co-packaged devices, owing to its excellent high-frequency performance, low dielectric loss, and superior thermomechanical stability. However, reliability issues with TGV technology remain one of the core challenges hindering the large-scale industrialization. The development history of TGV technology, its current application research status, the fabrication processes of glass interposers, and recent advancements in reliability studies are systematically reviewed. The reliability problems of key TGV interconnect structures caused by processing, design, and thermal stress are particularly discussed. After summarizing common interconnect failure mechanisms, the current shortcomings are highlighted in TGV reliability research, including studies on multi-field coupled failures, collaborative evaluation of multiple performance parameters, and the development of failure analysis methods. In response to the demand for developing next-generation high-performance devices based on TGV technology, key areas requiring further attention in future reliability research are analyzed. Insights and references for subsequent systematic reliability studies on glass interposers and TGV technology are provided.

Key words: through glass via technology, advanced packaging, reliability research, thermalmechanical induced failure, electrical migration

中图分类号: