玻璃基板在光电共封装技术中的应用*

doi:10.16257/j.cnki.1681-1070.2025.0156

摘要/Abstract

摘要： 人工智能和高性能计算对数据传输带宽与能效的需求不断上升，而传统铜互联技术存在信号衰减、功耗高和延迟大等局限。光电共封装技术通过实现光子集成电路与电子集成电路的异质集成，为突破电互连瓶颈提供了新途径。重点分析玻璃基板作为中介层材料在光电共封装技术中的关键作用，阐述其低介电损耗、高热稳定性、宽光谱透明性及与光波导工艺兼容的优势。对玻璃基板光波导的离子交换制备技术、光电协同架构设计及前沿研究机构提出的典型方案进行系统讨论，同时评估玻璃基板光电共封装在制造良率、散热管理和标准化协同方面所面临的挑战，并预测其在数据中心等领域的应用潜力。

关键词: 玻璃基板, 光电共封装, 光波导集成, 异构集成, 高密度互连

Abstract: The increasing demand for data transmission bandwidth and energy efficiency driven by artificial intelligence and high-performance computing highlights the limitations of conventional copper interconnect technology, such as signal attenuation, high power consumption, and significant delays. Co-packaged optics technology achieves heterogeneous integration of photonic integrated circuits and electronic integrated circuits, providing a novel approach to overcoming the bottlenecks of electrical interconnects. The critical role of glass substrates as interposers in co-packaged optics technology is systematically analyzed, and the advantages of low dielectric loss, high thermal stability, wide spectral transparency, and compatibility with optical waveguide fabrication processes are illustrated. Discussions are provided on the ion-exchange technique for fabricating optical waveguides on glass substrates, the design of integrated electro-optical architectures, and representative schemes proposed by leading research institutions. In addition, challenges related to manufacturing yield, thermal management, and standardization coordination in glass substrate co-packaged optics technology are evaluated, and potential applications in data centers and related fields are projected.

Key words: glass substrate, co-packaged optics, optical waveguide integration, heterogeneous integration, high-density interconnect

中图分类号:

TN305.94

陈俊伟，魏来，杨斌，樊嘉杰，崔成强，张国旗. 玻璃基板在光电共封装技术中的应用^*[J]. 电子与封装, 2025, 25(7): 070105 .

CHEN Junwei, WEI Lai, YANG Bin, FAN Jiajie, CUI Chengqiang, ZHANG Guoqi. Application of Glass Substrates in Co-Packaged Optics Technology[J]. Electronics & Packaging, 2025, 25(7): 070105 .

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中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

玻璃基板在光电共封装技术中的应用^*

Application of Glass Substrates in Co-Packaged Optics Technology

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