关键词: 微波等离子处理, 导电胶形貌, 可靠性

Abstract: Mechanism of the effect of microwave plasma process on the morphology of the conductive adhesive is studied, and influence of the number of plasma cleanings on the reliability of the circuit is further analyzed. The results show that one-time plasma cleaning of the circuit after chiploading can effectively remove the organic contamination on the surfaces of the bonding fingers. Multiple plasma cleanings will change the composition of the conductive adhesive to seriously damage the morphology of the conductive adhesive, which is likely to cause the block of conductive adhesive off, affecting the reliability of the package. The effects of the morphology of the conductive adhesive and chip bonding strength after multiple plasma cleanings are studied, whichprovide a theoretical basis for adopting reasonable plasma treatment parameters.

Key words: microwave plasma cleaning, morphology of conductive adhesive, reliability