车用塑封集成电路封装失效率估计

doi:10.16257/j.cnki.1681-1070.2021.0901

电子与封装 ›› 2021, Vol. 21 ›› Issue (9): 090101 . doi: 10.16257/j.cnki.1681-1070.2021.0901

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车用塑封集成电路封装失效率估计

吴世芳¹;潘进豊¹;谢杰任²

1. 蔚思博检测技术合肥有限公司车电功能安全服务事业处，上海　201203；2. 虎尾科技大学，台湾云林 63230

收稿日期:2020-11-16 发布日期:2021-03-29
作者简介:吴世芳（1964—），男，台湾云林人，1989年成功大学矿冶及材料硕士，曾在Foundry及IC设计公司RD部门服务近30年，目前任职蔚思博检测（合肥）公司车电功能安全服务事业处总监，主要专长和研究方向为集成电路、车用电子功能安全架构设计、可靠度工程与发展、FMEA等。

Package Failure Ratefor the Automotive Plastic Package IC

WU Ted¹, PAN Peter¹, SHIE Jieren²

1. FunctionalSafety Service Division, VESP Technology Co. Ltd., Shanghai 201203,China; 2. National Formosa University, Yunlin, Taiwan 63230, China

Received:2020-11-16 Published:2021-03-29

摘要/Abstract

摘要： 可靠度预估计的方法众多，就IEC 62380的车用塑封集成电路封装失效率估计数学模型进行了探讨及拓展。提出车用供应链任务轮廓信息交换的方式和内容以确保可靠性与稳健性，并根据其数学模型发展了一套封装失效率估算流程和合理化方法，以帮助开发者更方便地应用规范，并使封装失效率预估更贴近真实状况。

关键词: 可靠度预估, 封装失效率预估, IEC62380, 任务轮廓

Abstract: There are many methods for predicting reliability. This research discusses and develops further only on the IEC 62380 about the mathematical estimation model of package failure rate for the automotive plastic package IC. In addition to the IEC 62380 model, this research provides the way and content of mission profiles exchanged along the entire supply chain to ensure robustness and reliability, as well as the development of a rational method and process to estimate the package failure rate based on the IEC 62380 mathematical model. The purposes have two, one to help developers to apply IEC 62380 easier, and the other to help to estimate the package failure rate closer to the real condition.

Key words: reliabilityprediction, packagefailurerateestimation, IEC62380, missionprofile

中图分类号:

TN305.94

吴世芳;潘进豊;谢杰任. 车用塑封集成电路封装失效率估计[J]. 电子与封装, 2021, 21(9): 090101 .

WU Ted, PAN Peter, SHIE Jieren. Package Failure Ratefor the Automotive Plastic Package IC[J]. Electronics & Packaging, 2021, 21(9): 090101 .

参考文献

[1] RADIVOJEVIC Z ，ABDUL-QUADIR Y，MYLLYKOSKI P , et al. Reliability prediction for TFBGA assemblies [J]. IEEE Transactions On Components And Packaging Technologies, 2006, 29(2): 379-384.
[2] LIU Y, IRVING S, RIOUX M. Delamination modeling for IC package with multiple initial cracks[C]// Proceedings - Electronic Components and Technology Conference, New Orleans, Louisiana, USA, 2003.
[3] CHE F X, ZHANG X R, JI L. Thermal aging induced underfill degradation and its effect on reliability of advanced packaging[C]// 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), Orlando, FL, United States, 2020.
[4] AUERBACH F, LENNIGER A. Power-cycling stability of IGBT modules[C]// Proc. IEEE Ind. Appl. Soc. Annu. Meeting, New Orleans, LA, USA, Oct. 5-9, 1997: 1248-1252.
[5] FIDES. Reliability methodology for electronic systems : FIDES Guide 2009 Edition A [EB/OL]. (2019-02-02) [2020-11-16]. www.fides-reliability .org.
[6] ES-AENOR. Electric components – reliability – reference conditions for failure rates and stress models for conversion: UNE-EN 61709-2017[S]. Switzerland : International Electrotechnical Commission, 2017.
[7] Siemens. Expected values for integrated circuits : SN29500-2[Z]. CT TIM RS Corporate Regulation & Standardization, Munich and Erlangen, 2010.
[8] Siemens. Expected values for contactors : SN29500-11[Z]. CT TIM RS Corporate Regulation & Standardization, Munich and Erlangen, 2015.
[9] Siemens. Expected values for electromechanical protection devices in low voltage networks : SN-29500-15 [Z]. CT TIM RS Corporate Regulation & Standardization, Munich and Erlangen, 2016.
[10] Siemens. Expected values for electromechanical Pushbuttons, signaling devices and position switches in low voltage networks : SN29500-16 [Z]. CT TIM RS Corporate Regulation & Standardization, Munich and Erlangen, 2010.
[11] International Electrotechnical Commission. Reliability data handbook – Universal model for reliability prediction of electronics components, PCBs and equipment : IEC TR 62380:2004[M]. First Edition. Switzerland : International Electrotechnical Commission, 2004.
[12] Siemens. Expected values for electrical connections, electrical connectors and sockets : SN29500-5[Z]. CT TIM RS Corporate Regulation & Standardization, Munich and Erlangen, 2004.
[13] NIRMAIER T, BURGER A, HARRANT M, et al. Mission pro?le aware robustness assessment of automotive power devices[C]// Design, Automation & Test in Europe Conference & Exhibition (DATE), 2014.
[14] 吴世芳, 潘进豊. 芯片封装测试产业上的功能安全[J]. 电子与封装, 2020, 20(4): 040101 .
[15] International Organization for Standardization. Road vehicles — functional safety — part 11: guidelines on application of ISO 26262 to semiconductors : ISO 26262:2018[S]. Second Edition. Switzerland : International Organization for Standardization, 2018.
[16] JEDEC standard. Power and temperature cycling : JESD22-A105C[S]. Virginia, USA, 2004.
[17] JEDEC standard. Temperature cycling : JESD22-A104B[S]. Virginia, USA, 2000.
[18] JEDEC standard. High temperature storage life: JESD22-A103B[S]. Virginia, USA, 2001.
[19] JEDEC standard. Failure mechanisms and models for semiconductor devices: JEP 122H[S]. Virginia, USA, 2016.
[20] KERVARREC G, RIAUDEL A. A universal reliability prediction model for SMD integrated circuits based on field failures[C]// European Symposium on Reliability of Electron Devices, Failure Physics and Analysis [online]. Microelectronics Reliability Elsevier, 1999, 39(6), 765-771.

中国电子学会电子制造与封装技术分会会刊

中国半导体行业协会封测分会会刊

无锡市集成电路学会会刊

车用塑封集成电路封装失效率估计

Package Failure Ratefor the Automotive Plastic Package IC

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