混合键合界面接触电阻及界面热阻研究进展*

doi:10.16257/j.cnki.1681-1070.2025.0069

摘要/Abstract

摘要： 随着半导体技术向更高集成度和性能要求方向发展，混合键合技术作为一种先进封装方法，在集成电路领域中展现出了巨大的应用潜力。综述了混合键合界面接触电阻和界面热阻的研究进展，探讨了混合键合在三维集成芯片中的应用，重点分析了其在降低电阻、优化热阻方面的技术突破。总结了影响界面电阻和热阻的关键因素，并评估了不同工艺对性能的影响。探讨了界面处理、表面粗糙度、清洗时间和退火工艺等因素对接触电阻的显著影响，分析了界面材料和多物理场耦合效应在优化热阻方面的重要作用。此外，细间距混合键合技术的进展推动了芯片封装密度的提升，但随着间距的缩小，界面应力和对准误差等问题仍需进一步解决。

关键词: 先进封装, 高密度互连, 接触电阻, 界面热阻, 开尔文结构

Abstract: As semiconductor technology advances towards higher levels of integration and performance, hybrid bonding technology has shown great potential in the field of integrated circuits as an advanced packaging method. The research progress on interfacial contact resistance and interfacial thermal resistance in hybrid bonding is reviewed, and its application in 3D integrated chips is discussed, with a focus on the technological breakthroughs in reducing resistance and optimizing thermal resistance. The key factors influencing interfacial resistance and thermal resistance are summarized, and the impact of various processes on performance is evaluated. The significant impacts of interfacial treatment, surface roughness, cleaning time, and annealing on contact resistance are investigated, and the important role of interfacial materials and multi-physical field coupling effects in optimizing thermal resistance is analyzed. Furthermore, the advancement of fine-pitch hybrid bonding technology has driven the increase in chip packaging density, but as the pitch continues to shrink, issues such as interfacial stress and alignment errors still need to be further addressed.

Key words: advanced packaging, high density interconnection, contact resistance, interfacial thermal resistance, Kelvin structure

中图分类号:

TN305.94

吴艺雄, 杜韵辉, 陶泽明, 钟毅, 于大全. 混合键合界面接触电阻及界面热阻研究进展^*[J]. 电子与封装, 2025, 25(5): 050101 .

WU Yixiong, DU Yunhui, TAO Zeming, ZHONG Yi, YU Daquan. Research Progress on Interfacial Contact Resistance and Interfacial Thermal Resistance of Hybrid Bonding[J]. Electronics & Packaging, 2025, 25(5): 050101 .

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中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

混合键合界面接触电阻及界面热阻研究进展^*

Research Progress on Interfacial Contact Resistance and Interfacial Thermal Resistance of Hybrid Bonding

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